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Application Notes

Processing of Carbon Fiber Reinforced Plastics (CFRP)

Hole drilling of 1.1 mm thick CFRP

Hole drilling of 1.1 mm thick CFRP5

Task / Problem

Due to its low weight, its high durability against mechanical and dynamic stress and its chemical resistance CFRP’s have a wide field of application especially in lightweight construction. Laser processing gives the opportunity for cutting, drilling and 3D-ablation of these materials wearless and forceless.


To cut the material without delamination and with high productivity it is best to use the short pulse duration of the JenLas® disk IR70E. Heat management and pulse energy must be in the right setting for these materials to achieve optimal results.


For carbon fiber reinforced thermosets holes (Ø 250 μm) can be drilled in less than 1s. Ablation rate is higher than 11 mm³/ min.For thermoplastic CFRP’s holes (Ø 610 μm) can be drilled in 7s.Ablation rate is 4 mm³/ min.There were no remarkable melting or delamination after processing CFRP’s.


The laser parameters have to be adjusted to the layer structure and resin of each CFRP to find best quality and quantity.The Jenoptik JenLas® disk IR70E is designed for industrial requirements. The high stability, a independently tunable pulse duration ( 30 ns – 300 ns ) and a pulse energy of up to 6.5 mJ make it the ideal tool for processing these challenging materials.

High speed micro drilling and ablation of metals

JenLas® disk IR70 / IR70E

Task / Problem

Drilling of small holes and ablation of grooves in various metals becomes more and more important in many fields of industry, e.g. for filters, needles in surgery, lubrication reservoirs or printing industry. For those applications the holes must have high aspect ratio and often high density hole pattern.


To drill metals with good quality and high drilling rates both JenLas® disk IR70 and IR70E can be used. These ns-disk lasers have high ablation rates due to high pulse energies (up to 7 mJ) with variable pulse length. Therefore thermal effects can be optimized.


The laser parameters can be independently adjusted to achieve best drilling results in various metals depending on the application requirements.The shown applications have similar results with Al, Cu, Mo, Mg and nickel alloy.The Jenoptik JenLas® IR70 / IR70E is designed for industrial requirements.The IR70 ( with long ns-pulses ) is best for achieving highest drilling rates whereas the IR70E ( with short ns-pulses ) is best for achieving best quality.

Laser micro cutting of Nitinol tubes for medical stents

Detail of a Nitinol stent

Detail of a Nitinol stent

Task / Problem

Nitinol, a biocompatible and super-elastic shape memory material, enables important medical applications like peripheral stents, endoscopes, and others.Stent production involves precise, damage-free and burr-free micro-cutting of small Nitinol tubes.Jenoptik’s femtosecond JenLas® D2.fs laser was employed as a light source for stent cutting, delivering highest quality results while supporting very high productivity.


Nitinol stent tubes have typical wall thicknesses of up to 250 μm. Cutting widths< 10 μm and steep tapers are required.The JenLas® D2.fs laser source was combined with a 50 mm cutting optic


Cutting with femtosecond pulses works on the basis of a “cold ablation” effect. This ensures burr-free micro-cuts without heat damage inside the material or at the surface. Cutting of extremely small radiuses and structures is supported. The cut tubes are ready for polishing. Cutting speeds of over 250 mm/min in 250 μm thick tube walls were achieved, with taper angles less than 1°. Back-wall damages are prevented by proper adjustment of laser parameters to the specific wall thicknesses and diameters of the stent tubes.


The results demonstrate that Jenoptik’s OEM femtosecond laser sourceJenLas® D2.fs is an ideal tool for micro-processing of challenging applications like Nitinol stent tubes. The laser was designed for industrial environments, featuring high optical output stability, < 400 fs pulse length and up to 40 μJ pulse energy.

Processing of hard and brittle materials

Processing industry diamond

Processing industry diamond

Task / Problem

Hard and brittle materials as for example ( Diamond, Wolfram carbide, SiC ) are used in all applications where hardness, adhesive wear and high temperature resistance as well as chemical resistance are necessary. Processing these materials with a laser gives the opportunity to increase the process speed at still good quality.


To process the material with high productivity and good quality it is best to use both the JenLas® disk IR70E or the JenLas® disk IR70. Heat management, pulse energy and pulse duration must be in the right setting for these materials to achieve optimal results.


We showed cutting speeds up to 2 m/min for 1.4 mm thick green Wolfram carbide. For SiC we achieved ablation rates up to 10 mm³/ min and for diamond we achieved 3 mm³/ min. There is only small burr for Wolfram carbide and SiC after processing.


The laser parameters can be independently adjusted to achieve best processing results in hard and brittle materials without abrasive wear or to much forceon the material.The Jenoptik JenLas® disk IR70E and IR70 are designed for industrial requirements. These lasers are best for processing these challenging materials either with long pulses ( IR70 ) or with short pulses ( IR70E ) depending on given requirements.




Carl Wang

Sales | Industrial Solutions

+86 021 3825 2380-102

Application Laboratory

+49 3641 65-3053

+49 3641 65-4011


+49 3641 65-4534

+49 3641 65-2540

Sales Laser Machines





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